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Full Details for 02-174. Download this opportunity as XML or XLS (See Help).
| 02-174 (East Asia Summer Institutes for U.S. Graduate Students) |
| Opportunity Code: | 02-174 |
| Title: | East Asia Summer Institutes for U.S. Graduate Students |
| Agency: | National Science Foundation |
| Type: | Grant |
| Category: | Science and Technology and other Research and Development | | Category Explaination: | 'null ' | | Post Date: | 03/10/2003 |
| Due Date: | 12/03/2012 | | Estimated Funding: | Not Available |
| Number of Awards: | 0 |
| Award Ceiling: | Not Available |
| Award Floor: | 0 |
| Cost Sharing: | 0 |
| Eligibility Categories: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility" |
| Eligibility Info: | Not Available |
| CFDA Number: | 47.075 |
| Mailing Address: | National Science Foundation, 4201 Wilson Boulevard, Arlington VA 22230 |
| Contact Location: | Headquarters |
| Contact Office: | Office of Budget, Finance and Award Management |
| Contact Information: | NSF Webmaster (If you have any problems linking to this funding announcement, please contact the NSF Webmaster )
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| URL For Additional Information: | NSF publication 02-174
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Full Description of Opportunity:
The East Asia Summer Institutes (EASI) provide U.S. graduate students in
science and engineering first-hand research experience in China, Japan,
Korea, or Taiwan, an introduction to the science and science policy
infrastructure of the respective location, and orientation to the culture
and language. The primary goals of EASI are to introduce students to East
Asia science and engineering in the context of a research laboratory, and
to initiate personal relationships that will better enable them to
collaborate with foreign counterparts in the future. The institutes last
approximately eight weeks from June to August and are administered in the
United States by the National Science Foundation (NSF) with co-sponsorship
by the National Institutes of Health (NIH). |
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